Physical Vapor Deposition (PVD)

Publisher:webmaster   Release time:2020-03-23   Browsing volume:4518
Physical vapor deposition (PVD) is a family of coating processes in which thin films are deposited by the condensation of a vaporized form of the desired film material onto the substrate.
This process is carried out in a vacuum at temperatures between 150 and 500°C.
The average thickness of various PVD coatings is 2-5 microns.
It is mostly used in sheet metal parts, etching parts, extrusion parts, and metal injection molding (MIM), Powder injection molding (PIM), machining and welding parts.

They are grouped into three principal types:
1- Vacuum evaporation
2- Sputtering
3- Ion plating

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